{"id":"e2cb0fbd-2573-48d8-a432-ba898d84a415","slug":"ed3design-engineering-bundles","kind":"mcp","name":"ed3design-engineering-bundles","summary":"Claude Code skill bundles for hardware/maker engineering: 8 skills across 3 plugins — parametric CAD (Fusion 360 MCP-Bridge, OpenSCAD), FDM/3D-printing workflows (BOM validation, embedded UI docs), em","owner":"Ed3Design","repoUrl":"https://github.com/Ed3Design/ed3design-engineering-bundles","license":"MIT","licenseTier":"permissive","trust":"community","stars":2,"match":null,"fewStars":true,"format":"mcp","createdAt":"2026-06-13T15:02:05.000Z","addedAt":"2026-10-21T04:41:56.512Z","logoUrl":"https://avatars.githubusercontent.com/u/258750711?v=4","linkOnly":false,"collection":null,"skillPath":null,"categories":["developer-tools","design-media","cloud-infra"],"tags":["3d-printing","cad","claude-code","claude-code-plugin","embedded-systems","fusion-360","maker","mechanical-design"],"runtime":"binary","local":true,"cloudCapable":false,"cloudCapability":"unknown","cloudReadyOnPlatform":false,"needsApiKey":false,"reviewed":false,"syncedAt":"2026-10-28T00:05:20.155Z","sample":false,"url":"https://conduits.dev/tools/ed3design-engineering-bundles","language":"Python","transports":["stdio"],"install":{},"requirements":{"env":[],"upstreamMayCharge":false},"tools":null,"readme":"# ed3design-engineering-bundles\n\n[![License: MIT](https://img.shields.io/badge/License-MIT-yellow.svg)](LICENSE)\n\n> Engineering-discipline library for Claude Code power users — hardware/maker focus. 8 skills across 3 thematic bundles covering parametric CAD, FDM/maker workflows, and embedded systems integration.\n\nSibling to [`ed3design-skill-bundles`](https://github.com/Ed3Design/ed3design-skill-bundles) (software-engineering focus). This repo concentrates on the **physical engineering** disciplines: CAD design, 3D-printed builds, embedded device onboarding.\n\n## 📦 Bundles\n\n| Bundle | Skills | Status |\n|---|---|---|\n| [`cad-design`](./cad-design/) | 5 (CAD API scripting, construction workflows, mechanical design principles, image-to-mesh, Fusion MCP-Bridge) | 🟡 v0.1.0 alpha |\n| [`maker-fdm`](./maker-fdm/) | 2 (BOM validation, embedded GUI documentation) | 🟡 v0.1.0 alpha |\n| [`embedded-systems`](./embedded-systems/) | 1 (Victron Cerbo GX Modbus onboarding — `Enabled=0` default trap) | 🟡 v0.1.0 alpha |\n\n**Total**: 8 skills + 1 helper tool — patterns extracted from real-world physical engineering practice and structured for reuse.\n\n> [!NOTE]\n> Status is `alpha` until the first signed `v0.1.0` Git tag is published. All bundles currently pass `claude plugin validate --strict` via CI on every PR, but no stable release has been cut yet. Treat the install instructions as pre-release for now.\n\n## 🚀 Quickstart\n\n### Via Claude Code Marketplace\n\n```\n/plugin marketplace add Ed3Design/ed3design-engineering-bundles\n/plugin install cad-design@ed3design-engineering-bundles\n/plugin install maker-fdm@ed3design-engineering-bundles\n/plugin install embedded-systems@ed3design-engineering-bundles\n```\n\n### Manual Install\n\n```bash\ngit clone https://github.com/Ed3Design/ed3design-engineering-bundles\nln -s \"$(pwd)/ed3design-engineering-bundles/cad-design/skills\"/* ~/.claude/skills/\nln -s \"$(pwd)/ed3design-engineering-bundles/maker-fdm/skills\"/* ~/.claude/skills/\nln -s \"$(pwd)/ed3design-engineering-bundles/embedded-systems/skills\"/* ~/.claude/skills/\n```\n\n## 🧭 Why a separate repo from `ed3design-skill-bundles`?\n\nThe software-engineering bundles (token-savers, code-quality, planning, schema-discipline, etc.) share an audience: developers who write code. The hardware/maker bundles share a different audience: makers, mechanical engineers, embedded-systems hobbyists. Splitting them into two repos makes discovery clearer for both audiences and lets each repo grow without bloating the other.\n\n## 🔗 Related\n\n- **`ed3design-skill-bundles`** — software engineering: token optimization, code quality, planning, async/SQL debugging, skill-system meta\n- **`ed3design`** brand: maker-focused engineering tools for makers, makers' AI workflows, and CAD/3D-printing automation\n\n## 📚 Pattern Compound\n\nA typical hardware engineering session might layer these bundles:\n\n1. **`cad-design`** — design the part (parametric CAD, MCP-Bridge for closed-loop iteration)\n2. **`maker-fdm`** — validate the BOM before ordering, document the embedded UI from source\n3. **`embedded-systems`** — onboard the new Victron/Modbus device on first connection\n\nEach bundle works standalone, but loaded together they cover the design → build → integrate flow end-to-end.\n\n## License\n\nMIT. See [LICENSE](LICENSE).\n"}